Security Agreement

Recorded: 2005-01-10 Received: 2005-01-10 Pages: 16

Assignor

Executed: 2005-01-07

Assignee

TALLWOOD II PARTNERS, L.P.

635 WAVERLEY STREET, PALO ALTO, CA, 94301, UNITED STATES

Covered Properties (8)

Heat sink and method for manufacturing the same

Application: 10/753,500 →

Chip assembly with glue-strengthening holes

Application: 10/737,906 →

Heat Radiating Device of Chip

Application: 10/602,769 →

Radiator Fin Formed by Sintering Operation

Application: 10/368,439 →

Heat dissipating device for an electronic component

Application: 10/336,826 →

Heat Dissipating Device Adapted to Be Applied to a Flip Chip Device

Application: 10/016,414 →

Heat Dissipation Device with Ribbed Fin Plates

Application: 09/822,597 →

Remote Change of State for Laboratory Equipment

Application: 09/774,390 →