IP Library › Patent Application 10016414
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App. No. 10/016,414 · Confirmation No. 8647

HEAT DISSIPATING DEVICE ADAPTED TO BE APPLIED TO A FLIP CHIP DEVICE

Inventor: Jackie Lin
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗
⬇ PDF
 Code Description Pages PDF
2001-12-10 TRNA Transmittal of New Application 2 View
2001-12-10 SPEC Specification 7 View
2001-12-10 CLM Claims 2 View
2001-12-10 ABST Abstract 1 View
2001-12-10 DRW Drawings-only black and white line drawings 3 View
2001-12-10 OATH Oath or Declaration filed 4 View
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Quick Facts
App. No.
10/016,414
Filed
2001-12-10
Granted
2002-11-26
Art Unit
2835
PTA
0 days