Assignment of Assignor's Interest

Recorded: 2001-12-18 Pages: 2

Assignor

LIN, JACKIE

Executed: 2001-11-29

Assignee

ADVANCED THERMAL TECHNOLOGIES

2F, NO. 19-6, ALLEY 1, LANE 176, FU-TE 1ST RD., SHI-CHIH CITY TAIPEI HSIEN, TAIWAN

Covered Property (1)

Heat Dissipating Device Adapted to Be Applied to a Flip Chip Device

Patent: 6,487,077 →

Application: 10/016,414 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.