Patent Assignment
Reel/Frame 017207/0498
Assignment of Assignor's Interest
Recorded: 2006-01-25
Pages: 3
Assignor
ADVANCED THERMAL TECHNOLOGIES
Executed: 2005-12-21
Assignee
AMULAIRE THERMAL TECHNOLOGY, INC.
2F., NO. 31, ALLEY 1, LANE 342, FU-TE 1ST RD., SHI-CHIH CITY, TAIPEI HSIEN, TAIWAN
Covered Property
(1)
Heat Dissipating Device Adapted to Be Applied to a Flip Chip Device
Patent:
6,487,077 →
Application:
10/016,414 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.