IP Library Assignment 014821/0067
Patent Assignment
Reel/Frame 014821/0067

Assignment of Assignor's Interest

Recorded: 2003-12-19 Pages: 2
Assignors
LIAO, VIRGIL
Executed: 2003-11-26
WENG, BEN
Executed: 2003-11-26
WANG, JAI YI
Executed: 2003-11-26
Assignee
VATE TECHNOLOGY CO., LTD.
NO. 9, LI-HSIN RD., V, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property (1)
Substrate Structure Capable of Reducing Package Singular Stress
Patent: 6,933,592 →
Application: 10/739,168 →
Publication: US 2005/0133890
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 4, 2004
From: VATE TECHNOLOGY CO., LTD.
To: GLOBAL ADVANCED PACKAGING TECHNOLOGY H.K. LIMITED
Reel/Frame 015216/0295 →
Change of Name Nov 14, 2011
From: VATE TECHNOLOGY CO., LTD.
To: ASE ASSEMBLY AND TEST (H.K.) LIMITED
Reel/Frame 027218/0526 →
Assignment of Assignor's Interest Nov 19, 2011
From: ASE ASSEMBLY AND TEST (H.K.) LIMITED
To: ASE ASSEMBLY AND TEST (SHANGHAI) LTD.
Reel/Frame 027264/0669 →