IP Library › Assignment 027218/0526
Patent Assignment
Reel/Frame 027218/0526

Change of Name

Recorded: 2011-11-14 Pages: 2
Assignor
VATE TECHNOLOGY CO., LTD.
Executed: 2004-09-21
Assignee
ASE ASSEMBLY AND TEST (H.K.) LIMITED
34TH FLOOR, THE LEE GARDENS, 33 HYSAN AVENUE, CAUSEWAY BAY, HONG KONG
Covered Properties (7)
Stacked Chip Scale Package Structure
Patent: 6,633,086 →
Application: 10/162,910 →
Structure of Plated Wire of Fiducial Marks for Die-Dicing Package
Patent: 6,570,263 →
Application: 10/162,912 →
Multiple Stacked-Chip Packaging Structure
Patent: 7,091,590 →
Application: 10/637,670 →
Publication: US 2005/0035461
Substrate Structure Capable of Reducing Package Singular Stress
Patent: 6,933,592 →
Application: 10/739,168 →
Publication: US 2005/0133890
Structure of Gold Fingers
Patent: 6,937,477 →
Application: 10/760,356 →
Publication: US 2005/0156303
Packaging Stacked Chips with Finger Structure
Patent: 7,095,091 →
Application: 10/880,738 →
Publication: US 2006/0001148
Electroplated Wire Layout for Package Sawing
Patent: 7,098,524 →
Application: 10/911,585 →
Publication: US 2006/0027918
Related Assignments (15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 6, 2002
From: PENG, YI-LIANG; WU, KAI-CHIANG
To: VATE TECHNOLOGY CO., LTD.
Reel/Frame 012968/0712 →
Assignment of Assignor's Interest Jun 6, 2002
From: WU, KAI-CHIANG; PENG, YI-LIANG; CHENG, YA-YUN
To: VATE TECHNOLOGY CO., LTD.
Reel/Frame 012975/0526 →
Assignment of Assignor's Interest Aug 11, 2003
From: WU, WAN HUA; WU, KAI CHIANG
To: VATE TECHNOLOGY CO., LTD.
Reel/Frame 014389/0313 →
Assignment of Assignor's Interest Dec 19, 2003
From: LIAO, VIRGIL; WENG, BEN; WANG, JAI YI
To: VATE TECHNOLOGY CO., LTD.
Reel/Frame 014821/0067 →
Assignment of Assignor's Interest Jan 21, 2004
From: WU, KAI-CHIANG
To: VATE TECHNOLOGY CO., LTD.
Reel/Frame 014914/0230 →
Assignment of Assignor's Interest Jul 12, 2004
From: WU, KAI-CHIANG; CHEN, SHAW-WEI
To: VATE TECHNOLOGYK CO., LTD.
Reel/Frame 014840/0601 →
Assignment of Assignor's Interest Aug 13, 2004
From: WU, KAI-CHIANG; CHEN, SHAW-WEI
To: VATE TECHNOLOGY CO., LTD.
Reel/Frame 015061/0389 →
Assignment of Assignor's Interest Oct 4, 2004
From: VATE TECHNOLOGY CO., LTD.
To: GLOBAL ADVANCED PACKAGING TECHNOLOGY H.K. LIMITED
Reel/Frame 015215/0163 →
Assignment of Assignor's Interest Oct 4, 2004
From: VATE TECHNOLOGY CO., LTD.
To: GLOBAL ADVANCED PACKAGING TECHNOLOGY H.K. LIMITED
Reel/Frame 015215/0161 →
Assignment of Assignor's Interest Oct 4, 2004
From: VATE TECHNOLOGY CO., LTD.
To: GLOBAL ADVANCED PACKAGING TECHNOLOGY H.K. LIMITED
Reel/Frame 015216/0295 →
Assignment of Assignor's Interest Oct 4, 2004
From: VATE TECHNOLOGY CO., LTD.
To: GLOBAL ADVANCED PACKAGING TECHNOLOGY H.K. LIMITED
Reel/Frame 015216/0311 →
Assignment of Assignor's Interest Oct 4, 2004
From: VATE TECHNOLOGY CO., LTD.
To: GLOBAL ADVANCED PACKAGING TECHNOLOGY H.K. LIMTED
Reel/Frame 015216/0313 →
Assignment of Assignor's Interest Oct 4, 2004
From: VATE TECHNOLOGY CO., LTD.
To: GLOBAL ADVANCED PACKAGING TECHNOLOGY H.K. LIMITED
Reel/Frame 015216/0366 →
Assignment of Assignor's Interest Oct 4, 2004
From: VATE TECHNOLOGY CO., LTD.
To: GLOBAL ADVANCED PACKAGING TECHNOLOGY H.K. LIMITED
Reel/Frame 015216/0368 →
Assignment of Assignor's Interest Nov 19, 2011
From: ASE ASSEMBLY AND TEST (H.K.) LIMITED
To: ASE ASSEMBLY AND TEST (SHANGHAI) LTD.
Reel/Frame 027264/0669 →