Electroplated wire layout for package sawing
View Patent ↗An electroplated wire layout for package sawing comprises a substrate with a plurality of chip arrays disposed thereon. A kerf having two scribe lines is disposed between every two chip arrays. Several solder ball pads corresponding to the chip arrays are disposed on a back surface of the substrate. Each solder ball pad has a solder ball electroplated wire extended into a kerf. There is also a kerf electroplated wire disposed in each kerf and above the scribe lines of the kerf in a zigzag way. The kerf electroplated wire is connected with the solder ball pad electroplated wires to achieve electric connection. By changing the shape of the kerf electroplated wire, the kerf electroplated wire can be easily cut off to enhance the yield and reliability and also lower the cost.
1. An electroplated wire layout for package sawing comprising:
a substrate with a plurality of chip arrays disposed thereon, a kerf being disposed between every two of said chip arrays, each said kerf having two scribe lines;
several solder ball pads corresponding to said chip arrays and disposed on a back surface of said substrate;
several solder ball pad electroplated wires, each connected to one of said solder ball pads and extended into said kerf; and
at least one kerf electroplated wire having a continuous periodically contoured shape and located only in said kerf, said at least one kerf electroplated wire extending above at least one of said scribe lines in a plurality of crossing points, said kerf electroplated wire being connected with said solder ball pad electroplated wires in said kerf to achieve an electric connection therebetween.
2. The electroplated wire layout for package sawing as claimed in claim 1 , wherein said at least one kerf electroplated wire is formed in an S shape.
3. The electroplated wire layout for package sawing as claimed in claim 1 , wherein said at least one kerf electroplated wire is formed in a bow shape.
4. The electroplated wire layout for package sawing as claimed in claim 1 , wherein said at least one kerf electroplated wire is formed in a W shape.
5. The electroplated wire layout for package sawing as claimed in claim 1 , wherein said at least one kerf electroplated wire is formed in a an angle shape.
6. The electroplated wire layout for package sawing as claimed in claim 1 , wherein said kerf is horizontally disposed between every two of said chip rays.
7. The electroplated wire layout for package sawing as claimed in claim 1 , wherein said kerf is vertically disposed between every two of said chip rays.