IP Library › Assignment 015061/0389
Patent Assignment
Reel/Frame 015061/0389

Assignment of Assignor's Interest

Recorded: 2004-08-13 Pages: 2
Assignors
WU, KAI-CHIANG
Executed: 2004-07-29
CHEN, SHAW-WEI
Executed: 2004-07-29
Assignee
VATE TECHNOLOGY CO., LTD.
NO. 9, LI-HSIN RD. V., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property (1)
Electroplated Wire Layout for Package Sawing
Patent: 7,098,524 →
Application: 10/911,585 →
Publication: US 2006/0027918
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 4, 2004
From: VATE TECHNOLOGY CO., LTD.
To: GLOBAL ADVANCED PACKAGING TECHNOLOGY H.K. LIMITED
Reel/Frame 015216/0368 →
Change of Name Nov 14, 2011
From: VATE TECHNOLOGY CO., LTD.
To: ASE ASSEMBLY AND TEST (H.K.) LIMITED
Reel/Frame 027218/0526 →
Assignment of Assignor's Interest Nov 19, 2011
From: ASE ASSEMBLY AND TEST (H.K.) LIMITED
To: ASE ASSEMBLY AND TEST (SHANGHAI) LTD.
Reel/Frame 027264/0669 →