IP Library › Assignment 014389/0313
Patent Assignment
Reel/Frame 014389/0313

Assignment of Assignor's Interest

Recorded: 2003-08-11 Pages: 2
Assignors
WU, WAN HUA
Executed: 2003-07-23
WU, KAI CHIANG
Executed: 2003-07-23
Assignee
VATE TECHNOLOGY CO., LTD.
NO. 9, LI-HSIN RD., V., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property (1)
Multiple Stacked-Chip Packaging Structure
Patent: 7,091,590 →
Application: 10/637,670 →
Publication: US 2005/0035461
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 4, 2004
From: VATE TECHNOLOGY CO., LTD.
To: GLOBAL ADVANCED PACKAGING TECHNOLOGY H.K. LIMITED
Reel/Frame 015216/0311 →
Change of Name Nov 14, 2011
From: VATE TECHNOLOGY CO., LTD.
To: ASE ASSEMBLY AND TEST (H.K.) LIMITED
Reel/Frame 027218/0526 →
Assignment of Assignor's Interest Nov 19, 2011
From: ASE ASSEMBLY AND TEST (H.K.) LIMITED
To: ASE ASSEMBLY AND TEST (SHANGHAI) LTD.
Reel/Frame 027264/0669 →