IP Library › Assignment 015216/0311
Patent Assignment
Reel/Frame 015216/0311

Assignment of Assignor's Interest

Recorded: 2004-10-04 Pages: 2
Assignor
VATE TECHNOLOGY CO., LTD.
Executed: 2004-09-21
Assignee
GLOBAL ADVANCED PACKAGING TECHNOLOGY H.K. LIMITED
UNIT A, 19/F, V GA BUILDING, 532 CASTLE PEAK ROAD, KOWLOON, HONG KONG
Covered Property (1)
Multiple Stacked-Chip Packaging Structure
Patent: 7,091,590 →
Application: 10/637,670 →
Publication: US 2005/0035461
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 11, 2003
From: WU, WAN HUA; WU, KAI CHIANG
To: VATE TECHNOLOGY CO., LTD.
Reel/Frame 014389/0313 →
Change of Name Nov 14, 2011
From: VATE TECHNOLOGY CO., LTD.
To: ASE ASSEMBLY AND TEST (H.K.) LIMITED
Reel/Frame 027218/0526 →
Assignment of Assignor's Interest Nov 19, 2011
From: ASE ASSEMBLY AND TEST (H.K.) LIMITED
To: ASE ASSEMBLY AND TEST (SHANGHAI) LTD.
Reel/Frame 027264/0669 →