IP Library › Assignment 014840/0601
Patent Assignment
Reel/Frame 014840/0601

Assignment of Assignor's Interest

Recorded: 2004-07-12 Pages: 2
Assignors
WU, KAI-CHIANG
Executed: 2004-06-14
CHEN, SHAW-WEI
Executed: 2004-06-14
Assignee
VATE TECHNOLOGYK CO., LTD.
NO. 9, LI-HSIN RD. V,, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property (1)
Packaging Stacked Chips with Finger Structure
Patent: 7,095,091 →
Application: 10/880,738 →
Publication: US 2006/0001148
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 4, 2004
From: VATE TECHNOLOGY CO., LTD.
To: GLOBAL ADVANCED PACKAGING TECHNOLOGY H.K. LIMITED
Reel/Frame 015216/0366 →
Change of Name Nov 14, 2011
From: VATE TECHNOLOGY CO., LTD.
To: ASE ASSEMBLY AND TEST (H.K.) LIMITED
Reel/Frame 027218/0526 →
Assignment of Assignor's Interest Nov 19, 2011
From: ASE ASSEMBLY AND TEST (H.K.) LIMITED
To: ASE ASSEMBLY AND TEST (SHANGHAI) LTD.
Reel/Frame 027264/0669 →