Patent Assignment
Reel/Frame 015216/0366
Assignment of Assignor's Interest
Recorded: 2004-10-04
Pages: 2
Assignor
VATE TECHNOLOGY CO., LTD.
Executed: 2004-09-21
Assignee
GLOBAL ADVANCED PACKAGING TECHNOLOGY H.K. LIMITED
UNIT A, 19/F, V GA BUILDING, 532 CASTLE PEAK ROAD, KOWLOON, HONG KONG
Covered Property
(1)
Packaging Stacked Chips with Finger Structure
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 12, 2004
From: WU, KAI-CHIANG; CHEN, SHAW-WEI
To: VATE TECHNOLOGYK CO., LTD.
Reel/Frame 014840/0601 →
Change of Name
Nov 14, 2011
From: VATE TECHNOLOGY CO., LTD.
To: ASE ASSEMBLY AND TEST (H.K.) LIMITED
Reel/Frame 027218/0526 →
Assignment of Assignor's Interest
Nov 19, 2011
From: ASE ASSEMBLY AND TEST (H.K.) LIMITED
To: ASE ASSEMBLY AND TEST (SHANGHAI) LTD.
Reel/Frame 027264/0669 →