IP Library › Granted Patent US 6,633,086
Granted Patent Utility
US 6,633,086 · App. 10/162,910

Stacked chip scale package structure

Inventors: Yi-Liang Peng, Kai-Chiang Wu
Patented Case View Patent ↗
Granted: Oct 14, 2003 Filed: Jun 6, 2002
Inventors
Yi-Liang Peng
Kai-Chiang Wu
Assignee (at issue)
Vate Technology Co., Ltd.

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Quick Facts
Patent No.
US 6,633,086
App. No.
10/162,910
Filed
2002-06-06
Granted
2003-10-14
Kind
B1