Patent Assignment
Reel/Frame 012968/0712
Assignment of Assignor's Interest
Recorded: 2002-06-06
Pages: 3
Assignee
VATE TECHNOLOGY CO., LTD.
SCIENCE-BASED INDUSTRIAL PARK, NO. 9, LI-HSIN RD. V, HSINCHU, TAIWAN
Covered Property
(1)
Stacked Chip Scale Package Structure
Patent:
6,633,086 →
Application:
10/162,910 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 4, 2004
From: VATE TECHNOLOGY CO., LTD.
To: GLOBAL ADVANCED PACKAGING TECHNOLOGY H.K. LIMITED
Reel/Frame 015215/0163 →
Change of Name
Nov 14, 2011
From: VATE TECHNOLOGY CO., LTD.
To: ASE ASSEMBLY AND TEST (H.K.) LIMITED
Reel/Frame 027218/0526 →
Assignment of Assignor's Interest
Nov 19, 2011
From: ASE ASSEMBLY AND TEST (H.K.) LIMITED
To: ASE ASSEMBLY AND TEST (SHANGHAI) LTD.
Reel/Frame 027264/0669 →