IP Library › Assignment 014825/0930
Patent Assignment
Reel/Frame 014825/0930

Assignment of Assignor's Interest

Recorded: 2004-07-07 Pages: 3
Assignors
YANG, WEN-KUN
Executed: 2004-04-30
YANG, WEN-PIN
Executed: 2004-04-30
Assignee
ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
NO. 65, GUANGFU N. RD., HUKOU SHIANG, HSINCHU, 303 R.O.C., TAIWAN
Covered Property (1)
Structure of Image Sensor Module and a Method for Manufacturing of Wafer Level Package
Patent: 7,061,106 →
Application: 10/833,345 →
Publication: US 2005/0242408
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 15, 2023
From: ADL ENGINEERING INC.; ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064926/0845 →
Change of Name Sep 15, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064927/0462 →
Assignment of Assignor's Interest Dec 27, 2023
From: ADL ENERGY CORP.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065957/0661 →