Patent Assignment
Reel/Frame 064926/0845
Merger
Recorded: 2023-09-15
Pages: 4
Assignors
ADL ENGINEERING INC.
Executed: 2012-06-13
ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Executed: 2012-06-13
Assignee
ADL ENGINEERING INC.
5F, NO. 65, GUANGFU N. RD., ZHONGXING VIL., HUKOU TOWNSHIP, HSINCHU COUNTY, 303, TAIWAN
Covered Properties
(38)
Wafer Level Package and the Process of the Same
Fan Out Type Wafer Level Package Structure and Method of the Same
Structure of Image Sensor Module and a Method for Manufacturing of Wafer Level Package
Structure of Package
Package Structure
Chip-Size Package Structure and Method of the Same
Image Sensor with a Protection Layer
Packaging Structure with Coplanar Filling Paste and Dice and with Patterned Glue for Wl-Csp
Fbga and Cob Package Structure for Image Sensor
Manufacturing Tool for Wafer Level Package and Method of Placing Dies
Fan Out Type Wafer Level Package Structure and Method of the Same
Semiconductor Device Protective Structure and Method for Fabricating the Same
Method and System of Trace Pull Test
Fan Out Type Wafer Level Package Structure and Method of the Same
Fan Out Type Wafer Level Package Structure and Method of the Same
3D Electronic Packaging Structure Having a Conductive Support Substrate
Structure of Image Sensor Module and a Method for Manufacturing of Wafer Level Package
Semiconductor Device Protective Structure and Method for Fabricating the Same
Structure and Process for Wl-Csp with Metal Cover
Image Sensor Module
Semiconductor Image Device Package with Die Receiving Through-Hole and Method of the Same
Rf Module Package for Releasing Stress
Wafer Level Package with Die Receiving Through-Hole and Method of the Same
Wafer Level Package with Die Receiving Through-Hole and Method of the Same
Chip Packaging Structure
Semiconductor Device Package with Die Receiving Through-Hole and Dual Build-Up Layers Over Both Side-Surfaces for Wlp and Method of the Same
Image Sensor Module Having Build-in Package Cavity and the Method of the Same
Semiconductor Device Package Having Multi-Chips with Side-by-Side Configuration and Method of the Same
Chip-Size Package Structure and Method of the Same
Method for Forming Filling Paste Structure of Wl Package
Semiconductor Device Package Having a Back Side Protective Scheme
Structure of Image Sensor Module and Method for Manufacturing of Wafer Level Package
Fan Out Type Wafer Level Package Structure and Method of the Same
Sensor Module Package Structure and Method of the Same
Wafer Level Package with Good Cte Performance
Semiconductor Device Package with Multi-Chips and Method of the Same
System-In-Package and Manufacturing Method of the Same
Fan Out Type Wafer Level Package Structure and Method of the Same
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 22, 2004
From: YANG, WEN-KUN; YANG, WEN-PIN; CHEN, SHIH-LI
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 014279/0151 →
Assignment of Assignor's Interest
Feb 20, 2004
From: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: WEN-KUN YANG
Reel/Frame 014362/0508 →
Assignment of Assignor's Interest
May 14, 2004
From: YANG, WEN-KUN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 014633/0468 →
Assignment of Assignor's Interest
Jul 7, 2004
From: YANG, WEN-KUN; YANG, WEN-PIN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 014825/0930 →
Assignment of Assignor's Interest
Aug 16, 2004
From: YANG, WEN-KUN; CHEN, SHIH-LI; SUN, WEN-BIN; LIN, MING-HUI
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 015690/0643 →
Assignment of Assignor's Interest
Jan 21, 2005
From: YANG, WEN-KUN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 016161/0491 →
Assignment of Assignor's Interest
Feb 25, 2005
From: YANG, WEN-KUN; YANG, CHIN-CHEN; CHIU, CHENG-HSIEN; SUN, WEN-BIN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 016304/0488 →
Assignment of Assignor's Interest
Feb 28, 2005
From: YANG, WEN-KUN; YANG, CHIN-CHEN; YANG, WEN-PING; SUN, WEN-BIN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 016311/0225 →
Assignment of Assignor's Interest
Mar 2, 2005
From: YANG, WEN-KUN; YANG, CHIN-CHEN; SUN, WEN-BIN; CHANG, JUI-HSIEN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 016316/0101 →
Assignment of Assignor's Interest
Jul 6, 2005
From: YANG, WEN-KUN; CHAO, KUANG-CHI; CHIU, CHENG-HSIEN; LIN, CHIHWEI
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 016766/0875 →
Assignment of Assignor's Interest
Sep 26, 2005
From: YANG, WEN-KUN; TAI, CHENG CHIEH
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 017038/0158 →
Assignment of Assignor's Interest
Jun 6, 2006
From: YANG, WEN-KUN; MOU, EDDY
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 017732/0507 →
Assignment of Assignor's Interest
Jun 27, 2006
From: YEW, MING-CHIH; YUAN, CHANG-ANN; CHOU, CHANG-YEN; CHIANG, KOU-NING
To: ADVANCED CHIP ENGINEERING TECHNOLOGIES INC.
Reel/Frame 018037/0583 →
Assignment of Assignor's Interest
Jul 7, 2006
From: YANG, WEN-KUN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 017891/0402 →
Assignment of Assignor's Interest
Jul 19, 2006
From: YANG, WEN KUN; YANG, WEN PIN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 018114/0908 →
Legal Documents Listed on Appendix A
Jan 9, 2009
From: YANG, WEN-KUN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 022086/0001 →
Assignment of Assignor's Interest
Jun 25, 2009
From: YANG, WEN-KUN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 022868/0528 →
Change of Name
Sep 15, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064927/0462 →
Assignment of Assignor's Interest
Dec 27, 2023
From: ADL ENERGY CORP.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065957/0661 →