Patent Assignment
Reel/Frame 022868/0528
Assignment of Assignor's Interest
Recorded: 2009-06-25
Pages: 4
Assignor
YANG, WEN-KUN
Executed: 2009-06-25
Assignee
ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP, HSINCHU COUNTY, 303, TAIWAN
Covered Properties
(5)
Fan Out Type Wafer Level Package Structure and Method of the Same
Fan Out Type Wafer Level Package Structure and Method of the Same
Fan Out Type Wafer Level Package Structure and Method of the Same
Fan out type wafer level package structure and method of the same
Application:
11/595,970 →
Publication:
US 2007/0059866
Fan Out Type Wafer Level Package Structure and Method of the Same
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 22, 2004
From: YANG, WEN-KUN; YANG, WEN-PIN; CHEN, SHIH-LI
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 014279/0151 →
Assignment of Assignor's Interest
Feb 20, 2004
From: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: WEN-KUN YANG
Reel/Frame 014362/0508 →
Legal Documents Listed on Appendix A
Jan 9, 2009
From: YANG, WEN-KUN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 022086/0001 →
Merger
Sep 15, 2023
From: ADL ENGINEERING INC.; ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064926/0845 →
Change of Name
Sep 15, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064927/0462 →
Assignment of Assignor's Interest
Dec 27, 2023
From: ADL ENERGY CORP.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065957/0661 →