Patent Assignment
Reel/Frame 014362/0508
Assignment of Assignor's Interest
Recorded: 2004-02-20
Pages: 3
Assignor
ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Executed: 2004-02-10
Assignee
WEN-KUN YANG
47, LANE 6,, ANKANG ST., HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Fan Out Type Wafer Level Package Structure and Method of the Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 22, 2004
From: YANG, WEN-KUN; YANG, WEN-PIN; CHEN, SHIH-LI
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 014279/0151 →
Legal Documents Listed on Appendix A
Jan 9, 2009
From: YANG, WEN-KUN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 022086/0001 →
Assignment of Assignor's Interest
Jun 25, 2009
From: YANG, WEN-KUN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 022868/0528 →
Merger
Sep 15, 2023
From: ADL ENGINEERING INC.; ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064926/0845 →
Change of Name
Sep 15, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064927/0462 →
Assignment of Assignor's Interest
Dec 27, 2023
From: ADL ENERGY CORP.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065957/0661 →