FBGA and COB package structure for image sensor
View Patent ↗A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.
1. A FBGA (Fine-pitch Ball Grid Array) package structure, comprising:
a die formed on a substrate, said die having a micron lens area;
adhesive film pattern formed on said die;
a transparent material adhered on said adhesive film pattern to cover said micro lens area on said die, thereby generating an air gap therebetween;
first pads formed on said substrate and second pads formed on said die;
wires connected between said first pads and second pads;
molding material substantially covered said wires;
conductive bumps attached on a under surface of said substrate; and
an IR filter formed above said micro lens area, wherein material of said IR filter comprises TiO 2 or light catalyzer.
2. The structure in claim 1 , wherein said die is an image sensor.
3. The structure in claim 2 , wherein said image sensor is CMOS image sensor.
4. The structure in claim 2 , wherein said image sensor is CCD image sensor.
5. The structure in claim 1 , wherein material of said adhesive film pattern is elastic material.
6. The structure in claim 5 , wherein said elastic material comprises UV type or thermal type material.
7. The structure in claim 1 , wherein said adhesive film pattern is formed by printing or tapping method.
8. The structure in claim 1 , wherein said transparent material comprises glass or quartz.
9. The structure in claim 1 , wherein said molding material comprises compound or liquid compound.
10. The structure in claim 1 , wherein said molding material is formed by molding or gluing method.
11. A Chip On Board (COB) structure of package module, comprising:
a substrate;
a die placed on said substrate, said die having a plurality of bonding pads and a micro lens area;
adhesive film pattern formed on said die; wherein material of said adhesive film pattern including UV type material;
a transparent material adhered on said adhesive film pattern to cover a micro lens area on said die, thereby generating an air gap there between;
a lens holder fixed on said substrate, said lens holder having at least one lens placed therein;
first pads formed on said substrate and second pads formed on said die;
wires connected between said first pads and second pads;
molding material substantially covered said wires; and
an IR filter formed above said micro lens areas, wherein material of said IR filter comprises TiO 2 or light catalyzer.
12. The structure in claim 11 , wherein said die is an image sensor.
13. The structure in claim 12 , wherein said image sensor is CMOS image sensor.
14. The structure in claim 12 , wherein said image sensor is CCD image sensor.
15. The structure in claim 11 , wherein material of said adhesive film is elastic material.
16. The structure in claim 15 , wherein said elastic material comprises UV type or thermal type material.
17. The structure in claim 11 , wherein said adhesive film pattern is formed by printing or tapping method.
18. The structure in claim 11 , wherein said transparent material comprises glass or quartz.
19. The structure in claim 11 , wherein a thickness of said transparent material is from about 100 μm to 200 μm.
20. The structure in claim 11 , wherein said substrate comprises printed circuit board.
21. The structure in claim 11 , wherein said molding material comprises compound or liquid compound.
22. The structure in claim 11 , wherein said molding material is formed by molding or gluing method.
23. The structure in claim 11 , further comprising a filter formed within said lens holder.
24. The structure in claim 23 , wherein said filter is an IR filtering layer formed on a surface of said transparent material.
25. The structure in claim 23 , wherein said filter is IR filter fixed within said lens holder.