IP Library › Assignment 016316/0101
Patent Assignment
Reel/Frame 016316/0101

Assignment of Assignor's Interest

Recorded: 2005-03-02 Pages: 4
Assignors
YANG, WEN-KUN
Executed: 2005-01-06
YANG, CHIN-CHEN
Executed: 2005-01-08
SUN, WEN-BIN
Executed: 2005-01-08
CHANG, JUI-HSIEN
Executed: 2005-01-08
YU, CHUN HUI
Executed: 2005-01-08
YUAN, HIS-YING
Executed: 2005-01-08
Assignee
ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP, HSINCHU COUNTY 303, R.O.C., TAIWAN
Covered Property (1)
Fbga and Cob Package Structure for Image Sensor
Patent: 7,279,782 →
Application: 11/029,929 →
Publication: US 2006/0145325
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 15, 2023
From: ADL ENGINEERING INC.; ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064926/0845 →
Change of Name Sep 15, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064927/0462 →
Assignment of Assignor's Interest Dec 27, 2023
From: ADL ENERGY CORP.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065957/0661 →