Patent Assignment
Reel/Frame 018037/0583
Assignment of Assignor's Interest
Recorded: 2006-06-27
Pages: 3
Assignors
YEW, MING-CHIH
Executed: 2006-06-13
YUAN, CHANG-ANN
Executed: 2006-06-13
CHOU, CHANG-YEN
Executed: 2006-06-13
CHIANG, KOU-NING
Executed: 2006-06-13
Assignee
ADVANCED CHIP ENGINEERING TECHNOLOGIES INC.
NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP, HSINCHU CITY 303, R.O.C., TAIWAN
Covered Property
(1)
3D Electronic Packaging Structure Having a Conductive Support Substrate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Sep 15, 2023
From: ADL ENGINEERING INC.; ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064926/0845 →
Change of Name
Sep 15, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064927/0462 →
Assignment of Assignor's Interest
Dec 27, 2023
From: ADL ENERGY CORP.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065957/0661 →