Patent Assignment
Reel/Frame 016304/0488
Assignment of Assignor's Interest
Recorded: 2005-02-25
Pages: 4
Assignors
YANG, WEN-KUN
Executed: 2005-01-06
YANG, CHIN-CHEN
Executed: 2005-01-06
CHIU, CHENG-HSIEN
Executed: 2005-01-06
SUN, WEN-BIN
Executed: 2005-01-06
YUAN, HIS-YING
Executed: 2005-01-06
CHAO, KUANG-CHI
Executed: 2005-01-06
YU, CHUN HUI
Executed: 2005-01-06
Assignee
ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP, HSINCHU COUNTY 303 TAIWAN, CHINA
Covered Property
(1)
Packaging Structure with Coplanar Filling Paste and Dice and with Patterned Glue for Wl-Csp
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Sep 15, 2023
From: ADL ENGINEERING INC.; ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064926/0845 →
Change of Name
Sep 15, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064927/0462 →
Assignment of Assignor's Interest
Dec 27, 2023
From: ADL ENERGY CORP.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065957/0661 →