Patent Assignment
Reel/Frame 014831/0205
Assignment of Assignor's Interest
Recorded: 2003-07-07
Pages: 2
Assignee
MITSUI MINING & SMELTING CO., LTD.
11-1, OSAKI 1-CHOME, SHINAGAWA-KU, TOKYO 141-8584, JAPAN
Covered Property
(1)
Method for Preparing Copper Foil with Insulating Layer and Copper Foil with Insulating Layer Prepared by the Method, and Printed Wiring Board Using the Copper Foil with Insulating Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.