Patent Assignment
Reel/Frame 014853/0326
Assignment of Assignor's Interest
Recorded: 2003-12-23
Pages: 3
Assignor
PALANDUZ, CENGIZ A.
Executed: 2003-12-22
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Integrated Circuit Package Substrate Having a Thin Film Capacitor Structure