Patent Assignment
Reel/Frame 014856/0164
Assignment of Assignor's Interest
Recorded: 2003-12-22
Pages: 3
Assignors
KIM, SARAH E.
Executed: 2003-12-17
LEE, KEVIN J.
Executed: 2003-12-17
TOWLE, STEVEN
Executed: 2003-12-18
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Methods of Processing Thick Ild Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.