Patent Assignment
Reel/Frame 014861/0842
Assignment of Assignor's Interest
Recorded: 2003-12-30
Pages: 3
Assignee
SAMSUNG ELECTRONICS, CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming a via Contact Structure Using a Dual Damascene Technique