Patent Assignment
Reel/Frame 014861/0995
Assignment of Assignor's Interest
Recorded: 2004-01-02
Received: 2004-01-12
Pages: 4
Assignors
CROWLEY, SEAN T.
Executed: 2003-09-18
FUSARO, JAMES M.
Executed: 2003-09-19
DARVEAUX, ROBERT F.
Executed: 2003-10-02
MILES, BARRY M.
Executed: 2003-10-02
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE RD., CHANDLER, AZ, 85248, UNITED STATES
Covered Property
(1)
Methods of making thin integrated circuit device packages with improved thermal performance and increased I/O density
Application:
10/667,759 →