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App. No. 10/667,759 · Confirmation No. 1384

Methods of making thin integrated circuit device packages with improved thermal performance and increased I/O density

Abandoned -- Failure to Respond to an Office Action
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2006-11-16 ABN Abandonment 2 View
2006-03-27 N/AP Notice of Appeal Filed 3 View
2006-03-15 CTAV Advisory Action (PTOL-303) 3 View
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2003-12-15 PEFN Pre-Exam Formalities Notice 2 View
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2003-09-22 SPEC Specification 13 View
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Quick Facts
App. No.
10/667,759
Filed
2003-09-22
Art Unit
2822