IP Library Assignment 014889/0235
Patent Assignment
Reel/Frame 014889/0235

Assignment of Assignor's Interest

Recorded: 2004-01-13 Pages: 3
Assignors
KAWASHIMA, HIDEKAZU
Executed: 2004-01-06
KATOH, TETSUYA
Executed: 2004-01-06
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Method and Device for Producing Layout Patters of a Semiconductor Device Having an Even Wafer Surface
Patent: 7,208,350 →
Application: 10/755,387 →
Publication: US 2004/0230769
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Dec 22, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025525/0136 →