Patent Assignment
Reel/Frame 025525/0136
Change of Name
Recorded: 2010-12-22
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Semiconductor Memory Device
Semiconductor Memory Device
Temperature Measuring Sensor Incorporated in Semiconductor Substrate, and Semiconductor Device Containing Such Temperature Measuring Sensor
Boundary Scan Device
Data Processing Apparatus That Shares a Single Semiconductor Memory Circuit Among Multiple Data Processing Units
Semiconductor Device Including a Heat-Transmitting and Electromagnetic-Noise-Blocking Substance and Method of Manufacturing the Same
Register File and Method for Designing a Register File
Semiconductor Device Including a Low Resistance Wiring Layer
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device Having a Fuse
Data Read Circuit in a Semiconductor Device Featuring Reduced Chip Area and Increased Data Transfer Rate
Semiconductor Device and Test Method for Manufacturing Same
Temperature Independent Current Source and Active Filter Circuit Using the Same
Phase-Locked Loop Circuit Reducing Steady State Phase Error
Etching and Cleaning Methods and Etching and Cleaning Apparatuses Used Therefor
Gamma Correcting Circuit and Panel Drive Apparatus Equipped with Gamma Correcting Circuit
Semiconductor Integrated Circuit Device Having Rom Decoder for Converting Digital Signal to Analog Signal
Circuit Simulation Apparatus Incorporating Diffusion Length Dependence of Transistors and Method for Creating Transistor Model
Apparatus for Driving a Plurality of Display Units Using Common Driving Circuits
Differntial Output Circuit for Improving Bandwidth
Operational Amplifier with Self Control Circuit for Realizing High Slew Rate Throughout Full Operating Range
Image Processing Apparatus Supporting Both Discrete Cosine Transform and Discrete Wavelet Transform
Semiconductor Device Including Bipolar Junction Transistor, and Production Method Therefor
Linear Image Sensor
Method of Manufacturing Semiconductor Device and Apparatus for Cleaning Substrate
Method for Forming Capacitor
Array-Type Processor Having State Control Units Controlling a Plurality of Processor Elements Arranged in a Matrix
Semiconductor Memory Device Having Mode Storing One Bit Data in Two Memory Cells and Method of Controlling Same
Controller-Driver, Display Device, and Display Method
Voltage Controlled Oscillator
Method for Manufacturing Semiconductor Device and Semiconductor Device
Method of Manufacturing a Flip-Chip Semiconductor Device with a Stress-Absorbing Layer Made of Thermosetting Resin
Semiconductor Integrated Circuit Device
Esd Protection Circuit with Plural Thyristors
Mram and Data Writing Method Therefor
Semiconductor Memory and Process for Fabricating the Same
High-Speed, Two-Port Dynamic Random Access Memory (Dram) with a Late-Write Configuration
Voltage Amplification Circuit
Network Control Device and Control Method and Program Thereof
Semiconductor Memory Device and Control Method Thereof
Level Shifter
Array-Type Processor Having Plural Processor Elements Controlled by a State Control Unit
Semiconductor Device and Method of Manufacturing the Same
Input Circuit
Clock Monitoring Apparatus
Semiconductor Memory
Electronic Device Capable of Preventing Electromagnetic Wave from Being Radiated
Semiconductor Device and Method of Fabricating Semiconductor Device with High Cmp Uniformity and Resistance to Loss That Occurs in Dicing
Encoder, Decoder, and Data Transfer System
Nonvolatile Semiconductor Memory Device and Method for Manufacturing Same
Master Slice Semiconductor Integrated Circuit
Production Method for Manufacturing a Plurality of Chip-Size Packages
Heterojunction Field Effect Type Semiconductor Device Having High Gate Turn-on Voltage and Low on-Resistance and Its Manufacturing Method
Method for Testing Semiconductor Memory Device and Test Circuit for Semiconductor Memory Device
Ccd Image Sensor
Electro-Static Discharge Protection Device
Pulse Width Modulation Signal Generating Apparatus Having Two Dead Times for On-Timings
Electronic Device Having External Terminals with Lead-Free Metal Thin Film Formed on the Surface Thereof
Method of Generating Test Pattern for Integrated Circuit
Semiconductor Switches and Switching Circuits for Microwave
Soi Substrate and Semiconductor Integrated Circuit Device
Capacitance Parameters Calculation Method for Mosfet and Program Therefor
Semiconductor Memory Device and Manufacturing Method Thereof
Semiconductor Device and Method for Manufacturing Same
Non-Volatile Memory and Method for Manufacturing Non-Volatile Memory
Voltage-Controlled Variable-Capacitance Device
Electrostatic Discharge Device
Frequency Detection Circuit and Data Processing Apparatus
Semiconductor Device and Method for Manufacturing Same
Semiconductor Device and Method for Manufacturing Same
Terminating Resistor Device and a Method for Testing a Terminating Resistor Circuit
Chemical Mechanical Polishing Method, and Washing/Rinsing Method Associated Therewith
Semiconductor Device Including P-Channel Type Transistor, and Production Method for Manufacturing Such Semiconductor Device
Nonvolatile Semiconductor Memory Device Capable of Accurately and Quickly Adjusting Step-Up Voltage
Cleaning Solution for Semiconductor Substrate
Semiconductor Device with Wiring Layers Forming a Capacitor
Semiconductor Device Having Superior Resistance to Moisture
Method and Device for Producing Layout Patters of a Semiconductor Device Having an Even Wafer Surface
Method for forming contact bumps for circuit board
Semiconductor Device Manufacturing Method for Improving Adhesivity of Copper Metal Layer to Barrier Layer
Optical Semiconductor Device and Process for Producing the Same
Semiconductor Device Including Ladder-Shaped Siloxane Hydride and Method for Manufacturing Same
Semiconductor Device with Bonding Pad Support Structure
A Voltage Controlled Oscillator with Switched Tuning Capacitors
Flip-Chip Type Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Method of Fabricating the Same
Semiconductor Device in Which Punchthrough Is Prevented
Warp-Suppressed Semiconductor Device
Semiconductor Device and Method for Manufacturing the Same
Semiconductor Device with Improved Reliability and Manufacturing Method of the Same
Data Generating Method for Forming Desired Crc Code
Display Apparatus Drive Circuit Having Plurality a of Cascade Connnected Driver Ics
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 28, 2003
From: HASHIMOTO, KIYOKAZU; FURUTA, HIROSHI
To: NEC ELECRONICS CORPORATION
Reel/Frame 014457/0174 →
Assignment of Assignor's Interest
Sep 4, 2003
From: TANAKA, NOBUE
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014467/0510 →
Assignment of Assignor's Interest
Sep 5, 2003
From: KASHIWAGI, SHINJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014467/0322 →
Assignment of Assignor's Interest
Sep 10, 2003
From: MOCHIZUKI, AKIRA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014480/0901 →
Assignment of Assignor's Interest
Sep 12, 2003
From: SUGIYAMA, AKIO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014497/0362 →
Assignment of Assignor's Interest
Sep 17, 2003
From: NAKAMURA, YOSHIAKI
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 014527/0052 →
Assignment of Assignor's Interest
Sep 22, 2003
From: KATO, FUMIHIKO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014525/0099 →
Assignment of Assignor's Interest
Sep 22, 2003
From: HAYASHIDA, KEIJI; HASEGAWA, ATSUSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014516/0595 →
Assignment of Assignor's Interest
Sep 24, 2003
From: ENJO, HIROYASU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014544/0986 →
Assignment of Assignor's Interest
Jan 13, 2004
From: UNEME, MASAKATSU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014875/0545 →
Assignment of Assignor's Interest
Jan 13, 2004
From: KAWAKAMI, SATOKO; KURITA, YOICHIRO; KIMURA, TAKEHIRO; KURODA, RYUYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014875/0477 →
Assignment of Assignor's Interest
Jan 13, 2004
From: KATO, TOSHIKAZU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014875/0510 →
Assignment of Assignor's Interest
Jan 13, 2004
From: SUDO, NAOAKI; SUGAWARA, HIROSHI; KAWAGUCHI, KAOICHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014875/0574 →
Assignment of Assignor's Interest
Apr 3, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017730/0697 →
Assignment of Assignor's Interest
May 13, 2014
From: RENESAS ELECTRONICS CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 032892/0212 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Patent Security Agreement
Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Release of Security Interest in Patents
Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Patent Security Agreement.
Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 053654 Frame: 0254. Assignor(S) Hereby Confirms the Assignment.
Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →