IP Library Granted Patent US 6,903,398
Granted Patent B2
US 6,903,398 · App. 10/746,341 · Granted Jun 7, 2005

Semiconductor device and method for manufacturing same

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Quick Facts
Patent No.
US 6,903,398
App. No.
10/746,341
Granted
Jun 7, 2005
Kind
B2
Abstract

A semiconductor device is provided which has a capacitor insulating film made up of zirconium aliminate being an amorphous film obtained by having crystalline dielectric contain amorphous aluminum oxide and having its composition of Al X Zr (1-X) O Y (0.05≦x≦0.3), hereby being capable of preventing, in a process of forming a capacitor of MIM (Metal Insulator Metal) structure, dielectric breakdown of a capacitor insulating film while a relative dielectric constant of a metal oxide film used as the capacitor insulating film is kept high.

Claims (14)

1. A semiconductor device comprising:

a capacitor of MIM (Metal Insulator Metal) structure comprising a lower electrode and an upper electrode each made up of a metal film, and a capacitor insulating film sandwiched between said lower electrode and said upper electrode;

wherein said capacitor insulating film is an amorphous metal oxide film consisting essentially of aluminum, a metal other than aluminum and oxygen, and a ratio “X” of a number of aluminum atoms to a sum of numbers of said aluminum atoms and the metal atoms other than said aluminum atom is set to be 0.05≦x≦0.3.

2. The semiconductor device according to claim 1 , wherein said metal other than said aluminum has a strong tendency to crystallize with oxygen.

3. The semiconductor device according to claim 1 , wherein said capacitor insulating film has a film thickness of 5 nm to 20 nm.

4. The semiconductor device according to claim 1 , wherein said metal other than said aluminum is at least any one selected from a group of zirconium, hafnium, or lanthanoid group element.

5. The semiconductor device according to claim 1 , wherein said upper electrode and said lower electrode are made of titanium nitride, tantalum nitride, or tungsten nitride.

6. The semiconductor device according to claim 1 , wherein said capacitor insulating film is formed by an ALD (Atomic Layer Deposition) method or a CVD (Chemical Vapor Deposition) method.

7. A semiconductor device comprising:

a capacitor of MIM (Metal Insulator Metal) structure comprising a lower electrode and an upper electrode each made up of a metal film, and a capacitor insulating film sandwiched between said lower electrode and said upper electrode;

wherein said capacitor insulating film is an amorphous metal oxide film consisting essentially of aluminum oxide, a metal oxide other than aluminum oxide, and a ratio “X” of a number of aluminum atoms to a sum of numbers of said aluminum atoms and the metal atoms other than said aluminum atom is set to be 0.05≦X≦0.3.

8. The semiconductor device according to claim 7 , wherein said metal oxide other than said aluminum oxide has a strong tendency to crystallize.

9. The semiconductor device according to claim 7 , wherein said capacitor insulating film has a film thickness of 5 nm to 20 nm.

10. The semiconductor device according to claim 7 , wherein the metal other than the aluminum is at least any one selected from a group of zirconium, hafnium, or lanthanoid group element.

Assignments (3)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
CHANGE OF NAME Recorded Dec 22, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025525/0136 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2003
From: YAMAMOTO, ICHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014859/0055 →