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App. No. 10/686,568 · Confirmation No. 8958

METHOD OF MANUFACTURING A FLIP-CHIP SEMICONDUCTOR DEVICE WITH A STRESS-ABSORBING LAYER MADE OF THERMOSETTING RESIN

Inventor: Hirokazu Honda
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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2004-03-16 NOA Notice of Allowance and Fees Due (PTOL-85) 3 View
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2004-03-16 1449 List of References cited by applicant and considered by examiner 2 View
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2003-10-17 TRNA Transmittal of New Application 3 View
2003-10-17 SPEC Specification 23 View
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Quick Facts
App. No.
10/686,568
Filed
2003-10-17
Granted
2004-07-27
Pub. No.
US20040082101A1
Art Unit
2824
PTA
0 days