Patent Assignment
Reel/Frame 015258/0478
Assignment of Assignor's Interest
Recorded: 2004-04-23
Pages: 3
Assignor
NEC CORPORATION
Executed: 2004-03-31
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Method of Manufacturing a Flip-Chip Semiconductor Device with a Stress-Absorbing Layer Made of Thermosetting Resin
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.