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App. No. 10/758,392 · Confirmation No. 6084

SEMICONDUCTOR DEVICE MANUFACTURING METHOD FOR IMPROVING ADHESIVITY OF COPPER METAL LAYER TO BARRIER LAYER

Inventor: Norio Okada
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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2004-08-05 IFEE Issue Fee Payment (PTO-85B) 1 View
2004-05-12 NOA Notice of Allowance and Fees Due (PTOL-85) 3 View
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2004-05-12 1449 List of References cited by applicant and considered by examiner 1 View
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2004-05-12 IIFW Issue Information including classification, examiner, name, claim, renumbering, etc. 1 View
2004-05-12 SRFW Search information including classification, databases and other search related notes 1 View
2004-05-10 SRNT Examiner's search strategy and results 2 View
2004-01-16 TRNA Transmittal of New Application 2 View
2004-01-16 SPEC Specification 10 View
2004-01-16 CLM Claims 3 View
2004-01-16 ABST Abstract 1 View
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Quick Facts
App. No.
10/758,392
Filed
2004-01-16
Granted
2004-11-23
Pub. No.
US20040152306A1
Art Unit
2812
PTA
0 days