Patent Assignment
Reel/Frame 014900/0662
Assignment of Assignor's Interest
Recorded: 2004-01-16
Pages: 2
Assignor
OKADA, NORIO
Executed: 2004-01-09
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device Manufacturing Method for Improving Adhesivity of Copper Metal Layer to Barrier Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.