IP Library Granted Patent US 7,067,884
Granted Patent B2
US 7,067,884 · App. 10/743,651 · Granted Jun 27, 2006

Electrostatic discharge device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,067,884
App. No.
10/743,651
Granted
Jun 27, 2006
Kind
B2
Abstract

M pieces of n-well regions nW are provided on a main surface of a p-type silicon substrate 3 , and p-well regions pW are provided among the n-well regions adjacent to one another. Moreover, each of the M pieces of n-well regions nW includes an n-type diffusion region nD and a p-type diffusion region pD 1 , which are formed therein. Furthermore, the p-well region pW includes a p-type diffusion region pD 2 therein. The n-type diffusion region nD in a j-th of the n-well region nW is connected to the p-type diffusion region pD 1 in a (j+1)-th of the n-well region 10 . The p-type diffusion region pD 1 in the first n-well region nW is connected to a first terminal 1 . The n-type diffusion region nD in the M-th of the n-well region nW is connected to a second terminal 2 . In response to a potential relation between desired terminal to be protected (not depicted) and discharge terminal (not depicted) during a normal operation, the first terminal is connected to either one of the terminals, of which potential is higher, and the second terminal 2 is connected to the other of which potential is lower.

Claims (18)

1. An electrostatic discharge device comprising:

a semiconductor substrate of a first conduction type;

first and second wells of a second conduction type opposite to said first conduction type, each of said first and second wells including a first diffusion region of said first conduction type and a second diffusion region of said second conduction type, said second diffusion region in said first well being connected to said first diffusion region in said second well; and

a third well of said first conduction type located between said first well and said second well, wherein said first, second and third wells cooperate with one another to perform a bipolar action;

a fourth well of said second conduction type including a first diffusion region of said first conduction type and a second diffusion region of said second conduction type, said first diffusion region in said fourth well being connected to said second diffusion region in said second well; and

a fifth well of said first conduction type located between said second well and said fourth well, wherein a voltage applied to said first diffusion region of said first well is higher than a voltage applied to said second diffusion region of said fourth well, and wherein said fifth well is free from a diffusion region of said first conductive type therein.

2. The electrostatic discharge device according to claim 1 , wherein said second, fourth and fifth well cooperate with one another to perform a bipolar action.

3. An electrostatic discharge device, comprising:

a semiconductor substrate of a first conduction type;

first and second wells of a second conduction type opposite to said first conduction type, each of said first and second wells including a first diffusion region of said first conduction type and a second diffusion region of said second conduction type, said second diffusion region in said first well being connected to said first diffusion region in said second well; and

a third well of said first conduction type formed between said first well and said second well and including a diffusion region of said first conduction type, wherein said diffusion region in said third well is divided into a plurality of portions, each of said portions being apart from each other.

4. The electrostatic discharge device according to claim 3 , wherein said diffusion region in said third well is exposed in a surface of said semiconductor substrate.

5. The electrostatic discharge device according to claim 3 , wherein said first, second and third wells cooperate with one another to perform a bipolar action.

6. The electrostatic discharge device according to claim 3 , further comprising:

a fourth well of said second conduction type including a first diffusion region of said first conduction type and a second diffusion region of said second conduction type, said first diffusion region in said fourth well being connected to said second diffusion region in said second well; and

a fifth well of said first conduction type located between said second well and said fourth well, wherein a voltage applied to said first diffusion region of said first well is higher than a voltage applied to said second diffusion region of said fourth well, and wherein said fifth well is free from a diffusion region of said first conductive type therein.

7. The electrostatic discharge device according to claim 6 , wherein said second, fourth and fifth well cooperate with one another to perform a bipolar action.

8. The electrostatic discharge device according to claim 3 , wherein said first and second wells are separated from said third well by shallow trench isolation.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION; TESSERA ADVANCED TECHNOLOGIES, INC; DTS, INC.; DTS LLC; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
Reel/Frame 052920/0001 →
SECURITY INTEREST Recorded Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.; VEVEO, INC.; INVENSAS CORPORATION; INVENSAS BONDING TECHNOLOGIES, INC.; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
SECURITY INTEREST Recorded Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.; DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; DTS, LLC; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2014
From: RENESAS ELECTRONICS CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 032892/0212 →
CHANGE OF NAME Recorded Dec 22, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025525/0136 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2003
From: OKUSHIMA, MOTOTSUGU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014843/0307 →