Semiconductor device and method of manufacturing the same
View Patent ↗The present invention relates to a semiconductor device in which a semiconductor element and a substrate are disposed face-to-face, the mixture of the thermoplastic resin and the thermosetting resin is provided between the semiconductor element having the electrode formed thereon and the substrate having the wiring pattern formed thereon, the mixture holding in contact the electrode of the semiconductor element and the wiring pattern of the substrate. The semiconductor device of the present invention is obtained by: providing a sealing resin, which is a mixture of a thermoplastic resin and a thermosetting resin, between the semiconductor element and the substrate; heating at a temperature greater than a melting temperature of the thermoplastic resin; applying pressure to the sealing resin so that it spreads through the space between the semiconductor element and the substrate; melt-bonding the semiconductor element and the substrate through a cooling contraction of the thermoplastic resin component; and heating at a temperature less than a melt bond temperature of the thermoplastic resin component to cure the thermosetting resin component.
1. A method for producing a semiconductor device comprising steps of:
providing a mixture of thermoplastic resin component and thermosetting resin component between constituent parts;
heating at a temperature greater than a melting temperature of said thermoplastic resin component;
applying pressure to said mixture so that it spreads through a space between said constituent parts;
completing a melt bonding of said constituent parts through a cooling contraction of said thermoplastic resin component; and
heating at a temperature less than a melt bond temperature of said thermoplastic resin component to cure said thermosetting resin component.
2. A method for producing a semiconductor device comprising steps of:
providing a mixture of thermoplastic resin component and thermosetting resin component between a semiconductor element and a substrate;
heating at a temperature greater than a melting temperature of said thermoplastic resin component;
applying pressure to said mixture so that it spreads through a space between said semiconductor element and said substrate;
completing a melt bonding of said semiconductor element and said substrate through a cooling contraction of said thermoplastic resin component; and
heating at a temperature less than a melt bond temperature of said thermoplastic resin component to cure said thermosetting resin component.
3. A method for producing a semiconductor device according to claim 1 , wherein
a melting temperature of said thermoplastic resin is greater than a glass transition temperature of said thermosetting resin.
4. A method for producing a semiconductor device according to claim 2 , wherein
a melting temperature of said thermoplastic resin is greater than a glass transition temperature of said thermosetting resin.
5. A method for producing a semiconductor device according to claim 3 , wherein
X·E 1 ·α 1 <(1−X)·E 2 ·α 2 holds, where
E 1 is a modulus of elasticity of said thermoplastic resin,
α 1 is a coefficient of thermal expansion of said thermoplastic resin,
E 2 is a modulus of elasticity of said thermosetting resin,
α 2 is a coefficient of thermal expansion of said thermosetting resin, and
X is a content by percentage of said thermoplastic resin in said mixture and 0<X<1.
6. A method for producing a semiconductor device according to claim 4 , wherein
X·E 1 ·α 1 <(1−X)·E 2 ·α 2 holds, where
E 1 is a modulus of elasticity of said thermoplastic resin,
α 1 is a coefficient of thermal expansion of said thermoplastic resin,
E 2 is a modulus of elasticity of said thermosetting resin,
α 2 is a coefficient of thermal expansion of said thermosetting resin, and
X is a content by percentage of said thermoplastic resin in said mixture and 0<X<1.
7. A method for producing a semiconductor device according to claim 5 , wherein
the modulus of elasticity E 1 of said thermoplastic resin is less than the modulus of elasticity E 2 of said thermosetting resin.
8. A method for producing a semiconductor device according to claim 6 , wherein
the modulus of elasticity E 1 of said thermoplastic resin is less than the modulus of elasticity E 2 of said thermosetting resin.
9. A method for producing a semiconductor device according to claim 5 , wherein
said X is in a range from 0.4 to 0.6.
10. A method for producing a semiconductor device according to claim 6 , wherein
said X is in a range from 0.4 to 0.6.
11. A method for producing a semiconductor device according to claim 1 , wherein
said thermoplastic resin is thermoplastic polyimide resin and said thermosetting resin is epoxy resin.
12. A method for producing a semiconductor device according to claim 2 , wherein
said thermoplastic resin is thermoplastic polyimide resin and said thermosetting resin is epoxy resin.