Patent Assignment
Reel/Frame 014893/0959
Assignment of Assignor's Interest
Recorded: 2004-01-13
Pages: 4
Assignors
TAKAHASHI, NOBUAKI
Executed: 2004-01-05
AKIMOTO, YUJI
Executed: 2004-01-05
ODA, MIKIO
Executed: 2004-01-05
KOUTA, HIKARU
Executed: 2004-01-05
Assignees
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method for forming contact bumps for circuit board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.