Patent Assignment
Reel/Frame 014898/0424
Assignment of Assignor's Interest
Recorded: 2003-10-08
Pages: 2
Assignor
TAKAOKA, YUJI
Executed: 2003-05-27
Assignee
SONY CORPORATION
7-35, KITASHINAGAWA 6-CHOME, SHINAGAWA-KU, TOKYO 141, JAPAN
Covered Property
(1)
Semiconductor Apparatus and Method of Manufacturing Same
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 8, 2003
From: TAKAOKA, YUJI
To: SONY CORPORATION
Reel/Frame 014987/0246 →
Assignment of Assignor's Interest
Apr 16, 2015
From: SONY CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 035430/0231 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →