Patent Assignment
Reel/Frame 014898/0565
Assignment of Assignor's Interest
Recorded: 2004-01-15
Pages: 2
Assignor
EDWARDS, ROBERT D.
Executed: 2004-01-14
Assignee
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
1701 NORTH STREET, ENDICOTT, NEW YORK, 13760
Covered Property
(1)
Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom
Application:
10/757,586 →
Publication:
US 2005/0157475
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
May 10, 2005
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: WACHOVIA BANK, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 016561/0605 →
Assignment of Assignor's Interest
May 18, 2007
From: WACHOVIA BANK, NATIONAL ASSOCIATION, AS AGENT
To: WACHOVIA CAPITAL FINANCE CORPORATION ( NEW ENGLAND), AS AGENT
Reel/Frame 019304/0676 →
Security Agreement
May 14, 2012
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 028230/0798 →
Assignment of Security Agreement
Mar 6, 2013
From: PNC BANK, NATIONAL ASSOCIATION
To: INTEGRIAN HOLDINGS, LLC
Reel/Frame 029938/0823 →