Patent Assignment
Reel/Frame 019304/0676
Assignment of Assignor's Interest
Recorded: 2007-05-18
Received: 2007-05-18
Pages: 11
Assignor
WACHOVIA BANK, NATIONAL ASSOCIATION, AS AGENT
Executed: 2007-04-23
Assignee
WACHOVIA CAPITAL FINANCE CORPORATION ( NEW ENGLAND), AS AGENT
ONE POST OFFICE SQUARE, BOSTON, MA, 02109, UNITED STATES
Covered Properties
(40)
Capacitor Material with Metal Component for Use in Circuitized Substrates, Circuitized Substrate Utilizing Same, Method of Making Said Circuitized Substrate, and Information Handling System Utilizing Said Circuitized Substrate
Application:
11/031,074 →
Circuitized Substrates Utilizing Three Smooth-Sided Conductive Layers as Part Thereof, Method of Making Same, and Electrical Assemblies and Information Handling Systems Utilizing Same
Application:
10/991,451 →
Method of Making Circuitized Substrates Utilizing Smooth-Sided Conductive Layers as Part Thereof
Application:
10/991,532 →
Method of Making a Circuitized Substrate Having a Plurality of Solder Connection Sites Thereon
Application:
10/968,929 →
High Speed Circuitized Substrate with Reduced Thru-Hole Stub, Method for Fabrication and Information Handling System Utilizing Same
Application:
10/955,741 →
Circuitized Substrate with Improved Impedance Contol Circuitry, Method of Making Same, Electrical Assembly and Information Handling System Utilizing Same
Application:
10/953,923 →
Information Handling System Utilizing Circuitized Substrate
Application:
10/933,260 →
Low Moisture Absorptive Circuitized Substrate, Method of Making Same, Electrical Assembly Utilizing Same, and Information Handling System Utilizing Same
Application:
10/920,235 →
Circuitized Substrate Assembly and Method of Making Same
Application:
10/915,483 →
Electrical Assembly with Internal Memory Circuitized Substrate Having Electronic Components Positioned Thereon, Method of Making Same, and Information Handling System Utilizing Same
Application:
10/900,386 →
Circuitized Substrate with Internal Organic Memory Device, Electrical Assembly Utilizing Same, and Information Handling System Utilizing Same
Application:
10/900,385 →
Circuitized Substrate with Filled Isolation Border, Method of Making Same, Electrical Assembly Utilizing Same, and Information Handling System Utilizing Same
Application:
10/882,170 →
Circuitized Substrate with Split Conductive Layer, Method of Making Same, Electrical Assembly Utilizing Same, and Information Handling System Utilizing Same
Application:
10/882,167 →
Electronic package with conductive pad capable of withstanding significant loads
Application:
10/868,066 →
Radio Frequency Device for Tracking Goods
Application:
10/860,071 →
Method and System for Tracking Goods
Application:
10/860,067 →
Circuitized Substrate
Application:
10/812,890 →
Dielectric Composition for Forming Dielectric Layer for Use in Circuitized Substrates
Application:
10/812,889 →
Method of Making Circuitized Substrate Assembly
Application:
10/811,915 →
Method of Making High Speed Circuit Board
Application:
10/811,817 →
Circuitized Substrate with Signal Wire Shielding, Electrical Assembly Utilizing Same and Method of Making
Application:
10/790,747 →
Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom
Application:
10/757,586 →
Item Identification Control Method
Application:
10/740,500 →
Printed Circuit Board with Low Cross-Talk Noise
Application:
10/740,398 →
Method of making multilayered printed circuit board with filled conductive holes
Application:
10/737,974 →
Method of Making Circuitized Substrate
Application:
10/679,302 →
Stacked Chip Electronic Package Having Laminate Carrier and Method of Making Same
Application:
10/661,616 →
Circuitized Substrate and Method of Making Same
Application:
10/643,909 →
Electronic Component Test Apparatus
Application:
10/630,722 →
Method of testing spacings in pattern of openings in PCB conductive layer
Application:
10/616,932 →
Electronic card
Application:
10/449,019 →
Pinned Electronic Package with Strengthened Conductive Pad
Application:
10/423,972 →
Electronic Package with Strengthened Conductive Pad
Application:
10/423,877 →
Material Separation to Form Segmented Product
Application:
10/409,066 →
Information Handling System
Application:
10/394,135 →
Multi-Chip Electronic Package Having Laminate Carrier and Method of Making Same
Application:
10/394,107 →
Information Handling System Utilizing Circuitized Substrate
Application:
10/379,575 →
Circuitized Substrate and Method of Making Same
Application:
10/370,529 →
High Speed Circuit Board and Method for Fabrication
Application:
10/354,000 →
Circuitized Substrate Assembly and Method of Making Same
Application:
10/322,527 →