Printed circuit board with low cross-talk noise
View Patent ↗A printed circuit board and a method of making same in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel signal lines running in substantially similar directions across said signal layers. Predetermined portions of the signal lines in one signal layer are aligned relative to and also parallel to corresponding signal lines in the other signal layer, with the power plane being located between these portions. Through hole connections are provided between selected signal lines in the two layers, these occurring through clearance holes in the power plane so as to be isolated therefrom.
1. A printed circuit board comprising:
a substantially solid power plane having first and second opposing sides;
first and second dielectric layers located on said first and second opposing sides of said substantially solid power plane, respectively;
a first signal layer located on said first dielectric layer and including a plurality of substantially parallel signal lines running in at least two directions across said first signal layer from a first side of said printed circuit board to a second side of said printed circuit board, said first signal layer being substantially parallel to said substantially solid power plane; and
a second signal layer located on said second dielectric layer and including a plurality of substantially parallel signal lines running in the same said at least two directions as said signal lines of said first signal layer across said second signal layer from said first side of said printed circuit board to said second side of said printed circuit board and of a substantially similar pattern as said signal lines of said first signal layer, said second signal layer also being substantially parallel to
said substantially solid power plane, at least a predetermined large portion of the number of signal lines in said first signal layer being aligned with and substantially parallel to a corresponding large portion of said signal lines in said second signal layer, said power plane located substantially between said predetermined portions of said aligned and substantially parallel signal lines to substantially reduce crosstalk between said first and second signal layers.
2. The printed circuit board of claim 1 wherein said power plane includes a plurality of clearance openings therein.
3. The printed circuit board of claim 2 further including a plurality of conductive through holes electrically connecting selected ones of said predetermined portion of signal lines in said first signal layer to corresponding selected ones of said predetermined portion of signal lines in said second signal layer, each of said conductive through holes passing through a selected one of said clearance openings in said power plane and being electrically isolated from said power plane such that said signal lines on both of said first and second signal layers are not electrically coupled to said power plane.
4. The printed circuit board of claim 3 wherein the number of said conductive through holes is within the range of from about 1 to about 10,000.
5. The printed circuit board according to claim 1 wherein said power plane and said signal lines in said first and second signal layers are each comprised of copper.
6. The printed circuit board of claim 1 wherein said predetermined large portions of said signal lines in each of said first and second signal layers ranges from about 25 to about 95 percent of the total number of signal lines in each of said signal planes.
7. The printed circuit board of claim 1 further including third and fourth dielectric layers on said first and second signal layers, respectively, and third and fourth conductive layers on said third and fourth dielectric layers, respectively.
8. The printed circuit board of claim 1 wherein adjacent signal lines in each of said first and second signal layers are positioned as closely as only about 0.002 inch apart within said signal layers, each of said signal lines within said first signal layer being positioned only about 0.005 inch from the corresponding signal line within said second signal layer.
9. The printed circuit board of claim 8 wherein each of said signal lines has a thickness of from about 0.0005 inch to about 0.002 inch.
10. The printed circuit board of claim 1 wherein said at least two directions which said signal lines of both said first and second signal layers run across said signal layers include a first direction and a second direction substantially perpendicular to said first direction.