Information handling system utilizing circuitized substrate
View Patent ↗An information handling system (e.g., computer, server, etc.) Utilizing at least one circuitized substrate assembly of robust construction and possessing enhanced operational capabilities. The substrate assemblies include a substrate having at least one opening which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.
1. An information handling system comprising a circuitized substrate assembly including a first circuitized substrate including alternating layers of dielectric material and conductive material therein and further including an opening therein extending substantially through the thickness of said first circuitized substrate, a second circuitized substrate bonded to said first circuitized substrate and including alternating layers of dielectric material and conductive material therein and further including an opening therein extending substantially through the thickness of said second circuitized substrate and aligned with said opening in said first circuitized substrate, said second circuitized substrate including a quantity of electrically conductive paste substantially completely filling said opening in said second, bonded circuitized substrate prior to and subsequent said bonding of said second circuitized substrate to said first circuitized substrate, said first circuitized substrate including substantially none of said electrically conductive paste within said opening of said first circuitized substrate prior to said bonding of said second circuitized substrate to said first circuitized substrate but including a portion of said electrically conductive paste within said opening within said first circuitized substrate subsequent to said bonding, said electrically conductive paste not being engaged by a layer of dielectric material prior to said bonding, and a layer of dielectric material positioned on an external surface of said first circuitized substrate and extending within said opening of said first circuitized substrate.
2. The information handling system of claim 1 wherein each of said openings in said first and second circuitized substrates includes an electrically conductive material thereon, said electrically conductive paste being in electrical contact with said electrically conductive material in both of said openings.
3. The information handling system of claim 2 wherein said electrically conductive material comprises a plated layer of metal.
4. The information handling system of claim 1 further including an interim dielectric layer between said first and second circuitized substrates.
5. The information handling system of claim 1 further including a third circuitized substrate also including alternating layers of dielectric material and conductive material therein and also having an opening therein extending substantially through the thickness of said third circuitized substrate and aligned with said opening within said second circuitized substrate, said third circuitized substrate bonded to said second circuitized substrate, said third circuitized substrate including substantially none of said electrically conductive paste within said opening of said third circuitized substrate prior to said bonding of said third circuitized substrate to said second circuitized substrate but including a portion of said electrically conductive paste within said opening within said third circuitized substrate subsequent to said bonding of said third circuitized substrate to said second circuitized substrate.
6. The information handling system of claim 5 wherein said opening in said third circuitized substrate includes an electrically conductive material thereon, said electrically conductive paste being in electrical contact with said electrically conductive material in said opening within said third circuitized substrate.
7. The information handling system of claim 6 wherein said electrically conductive material comprises a plated layer of metal.
8. The information handling system of claim 5 further including an interim dielectric layer between said second and third circuitized substrates.
9. The invention of claim 1 wherein said information handling system comprises a computer or a server.
10. An information handling system comprising a circuitized substrate assembly including a first circuitized substrate including alternating layers of dielectric material and conductive material therein and further including an opening therein extending substantially through the thickness of said first circuitized substrate, a second circuitized substrate bonded to said first circuitized substrate and including alternating layers of dielectric material and conductive material therein and further including an opening therein extending substantially through the thickness of said second circuitized substrate and aligned with said opening in said first circuitized substrate, said second circuitized substrate including a quantity of electrically conductive paste substantially completely filling said opening in said second, bonded circuitized substrate prior to and subsequent said bonding of said second circuitized substrate to said first circuitized substrate, said first circuitized substrate including substantially none of said electrically conductive paste within said opening of said first circuitized substrate prior to said bonding of said second circuitized substrate to said first circuitized substrate but including a portion of said electrically conductive paste within said opening within said first circuitized substrate subsequent to said bonding, said electrically conductive paste not being engaged by a layer of dielectric material prior to said bonding, a third circuitized substrate also including alternating layers of dielectric material and conductive material therein and also having an opening therein extending substantially through the thickness of said third circuitized substrate and aligned with said opening within said second circuitized substrate, said third circuitized substrate bonded to said second circuitized substrate and including substantially none of said electrically conductive paste within said opening of said third circuitized substrate prior to said bonding of said third circuitized substrate to said second circuitized substrate but including a portion of said electrically conductive paste within said opening within said third circuitized substrate subsequent to said bonding of said third circuitized substrate to said second circuitized substrate, and a layer of dielectric material positioned on an external surface of said third circuitized substrate and extending within said opening within said third circuitized substrate.
11. The information handling system of claim 10 wherein said opening in said third circuitized substrate includes an electrically conductive material thereon, said electrically conductive paste being in electrical contact with said electrically conductive material in said opening within said third circuitized substrate.
12. The information handling system of claim 11 wherein said electrically conductive material comprises a plated layer of metal.
13. The information handling system of claim 10 further including an interim dielectric layer between said second and third circuitized substrates.
14. The invention of claim 10 wherein said information handling system comprises a computer or a server.