Patent Assignment
Reel/Frame 014900/0087
Assignment of Assignor's Interest
Recorded: 2004-01-21
Pages: 2
Assignor
CHI MEI OPTOELECTRONICS CORPORATION
Executed: 2003-12-26
Assignees
CHI MEI OPTOELECTRONICS CORPORATION
NO. 1, CHI-YEH ROAD, HSIN-SHIH VILLAGE, TAINAN SCIENCE BASED INDUSTRIAL PARK, TAINAN COUNTY, R.O.C., TAIWAN
KYOCERA CORPORATION
6 TAKEDA TOBADONO-CHO, FUSHIMI-KU, KYOTO 612-8501, JAPAN
Covered Property
(1)
Plastic Substrate, Fabrication Method Thereof and Device Using the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 4, 2003
From: HU, CHEN-ZE; CHUNG, CHIA-TIN; CHEN, RUEY-MIN; LEE, YAO-HUI
To: CHI MEI OPTOELECTRONICS CORPORATION
Reel/Frame 014369/0617 →
Merger
May 5, 2010
From: CHI MEI OPTOELECTRONICS CORP.
To: CHIMEI INNOLUX CORPORATION
Reel/Frame 024329/0683 →
Change of Name
Apr 3, 2014
From: CHIMEI INNOLUX CORPORATION
To: INNOLUX CORPORATION
Reel/Frame 032604/0487 →
Assignment of Assignor's Interest
Jun 17, 2015
From: KYOCERA CORPORATION
To: INNOLUX CORPORATION
Reel/Frame 035934/0794 →