Patent Assignment
Reel/Frame 014922/0873
Assignment of Assignor's Interest
Recorded: 2004-01-26
Pages: 4
Assignors
LEE, KYOUNG-WOO
Executed: 2004-01-17
LEE, SOO-GEUN
Executed: 2004-01-17
PARK, WAN-JAE
Executed: 2004-01-17
KIM, JAE-HAK
Executed: 2004-01-17
SHIN, HONG-JAE
Executed: 2004-01-17
Assignee
SAMSUNG ELECTRONICS, CO., LTD.
416, MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Dual Damascene Interconnections of Microelectronic Device Using Hybrid Low K-Dielectric and Carbon-Free Inorganic Filler