IP Library Assignment 014928/0404
Patent Assignment
Reel/Frame 014928/0404

Assignment of Assignor's Interest

Recorded: 2004-01-28 Pages: 4
Assignors
NOZAWA, IWAO
Executed: 2003-12-26
HORI, TAKASHI
Executed: 2003-12-26
SOMA, DAISUKE
Executed: 2003-12-26
ROPPONGI, TAKAHIRO
Executed: 2003-12-26
Assignee
SENJU METAL INDUSTRY CO., LTD.
23 SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO 120-8555, JAPAN
Covered Property (1)
Solder for Use on Surfaces Coated with Nickel by Electroless Plating
Patent: 7,132,020 →
Application: 10/668,377 →
Publication: US 2004/0126269