IP Library Assignment 014929/0667
Patent Assignment
Reel/Frame 014929/0667

Assignment of Assignor's Interest

Recorded: 2004-08-02 Pages: 3
Assignor
MIYAZAWA, IKUYA
Executed: 2004-07-22
Assignee
SEIKO EPSON CORPORATION
4-1 NISHI-SHINJUKI, 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property (1)
Method of Manufacturing Semiconductor Device, Semiconductor Device, Circuit Substrate and Electronic Apparatus
Patent: 7,214,615 →
Application: 10/801,952 →
Publication: US 2004/0238927
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 2012
From: SEIKO EPSON CORPORATION
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028153/0654 →