Patent Assignment
Reel/Frame 014947/0056
Assignment of Assignor's Interest
Recorded: 2004-02-02
Pages: 2
Assignor
ONG, ADRIAN E.
Executed: 2003-06-02
Assignee
INAPAC TECHNOLOGY, INC.
2290 NORTH FIRST STREET, SUITE 201, SAN JOSE, CALIFORNIA, 95131
Covered Property
(1)
Layout and Use of Bond Pads and Probe Pads for Testing of Integrated Circuits Devices
Patent:
7,061,263 →
Application:
10/003,375 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.