Patent Assignment
Reel/Frame 022597/0896
Assignment of Assignor's Interest
Recorded: 2009-04-28
Pages: 8
Assignor
INAPAC TECHNOLOGY, INC.
Executed: 2009-02-27
Assignee
RAMBUS INC.
4440 EL CAMINO REAL, LOS ALTOS, CALIFORNIA, 94022
Covered Properties
(39)
Chip Testing Within a Multi-Chip Semiconductor Package
Patent:
6,732,304 →
Application:
09/666,208 →
Circuit and Method for Determining the Operating Point of a Semiconductor Device
Patent:
6,693,449 →
Application:
09/851,512 →
Systems and Methods for a High-Speed Dynamic Data Bus
Patent:
7,157,940 →
Application:
09/888,970 →
Configurable Addressing for Multiple Chips in a Package
Patent:
6,657,914 →
Application:
09/909,675 →
Testing of Integrated Circuit Devices
Patent:
6,754,866 →
Application:
09/967,389 →
Layout and Use of Bond Pads and Probe Pads for Testing of Integrated Circuits Devices
Patent:
7,061,263 →
Application:
10/003,375 →
High-Speed Segmented Data Bus Architecture
Patent:
6,996,652 →
Application:
10/251,530 →
Entering Test Mode and Accessing of a Packaged Semiconductor Device
Patent:
6,812,726 →
Application:
10/305,635 →
Bonding Pads for Testing of a Semiconductor Device
Set Up for a First Integrated Circuit Chip to Allow for Testing of a Co-Packaged Second Integrated Circuit Chip
Patent:
7,006,940 →
Application:
10/679,673 →
Semiconductor device with a plurality of ground planes
Application:
10/810,510 →
Publication:
US 2005/0224942
Chip Testing Within a Multi-Chip Semiconductor Package
Testing of Integrated Circuit Devices
Multiple Power Levels for a Chip Within a Multi-Chip Semiconductor Package
Monitoring Signals Between Two Integrated Circuit Devices Within a Single Package
Patent:
7,133,798 →
Application:
10/967,749 →
Internally Generating Patterns for Testing in an Integrated Circuit Device
Bonding Pads for Testing of a Semiconductor Device
Architecture and Method for Testing of an Integrated Circuit Device
Electronic Device Having an Interface Supported Testing Mode
Processor-Memory Unit for Use in System-in-Package and System-in-Module Devices
Patent:
7,673,193 →
Application:
11/208,099 →
Shared Bond Pad for Testing a Memory Within a Packaged Semiconductor Device
Component Testing and Recovery
Integrated Circuit Testing Module
Integrated Circuit Testing Module Including Data Compression
Integrated Circuit Testing Module Including Data Generator
Patent:
7,365,557 →
Application:
11/370,769 →
Integrated Circuit Testing Module Including Address Generator
Patent:
7,446,551 →
Application:
11/370,795 →
Isolating electric paths in semiconductor device packages
Integrated Circuit Testing Module Including Command Driver
Shared Memory Bus Architecture for System with Processor and Memory Units
Integrated Circuit Test Array Including Test Module
Delay Lock Loop Delay Adjusting Method and Apparatus
Patent:
7,269,524 →
Application:
11/480,234 →
Testing and Recovery in a Multilayer Device
Integrated Circuit Testing Module Including Signal Shaping Interface
Integrated Circuit Testing Module Configured for Set-Up and Hold Time Testing
Memory Device Including Multiplexed Inputs
Memory Accessing Circuit System
Electronic Device Having an Interface Supported Testing Mode
Testing Fuse Configurations in Semiconductor Devices
Programmable Memory Repair Scheme
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 12, 2007
From: ONG, ADRIAN E.
To: INAPEC TECHNOLOGY, INC.
Reel/Frame 020106/0911 →
Ucc Financing Statement Filed in California
Aug 15, 2008
From: INAPAC TECHNOLOGY, INC.
To: CARR & FERRELL LLP
Reel/Frame 021425/0952 →
Release of Security Agreement (Ca)
Jan 22, 2009
From: CARR & FERRELL LLP
To: INAPAC TECHNOLOGY, INC.
Reel/Frame 022158/0338 →
Document Re-Recorded to Correct Errors Contained in Property Number(S) 11/803,473. Doucment Previously Recorded on Reel 020108 Frame 0911.
Nov 3, 2009
From: ONG, ADRIAN E.
To: INAPAC TECHNOLOGY, INC.
Reel/Frame 023466/0080 →
Assignment of Assignor's Interest
Jun 4, 2014
From: RAMBUS INC.
To: SCA IPLA HOLDINGS INC.
Reel/Frame 033026/0152 →
Assignment of Assignor's Interest
Dec 2, 2021
From: RAMBUS INC.
To: HIGHLANDS LLC
Reel/Frame 058298/0836 →
Assignment of Assignor's Interest
Dec 10, 2021
From: HIGHLANDS LLC
To: RAMPART ASSET MANAGEMENT, LLC
Reel/Frame 058956/0139 →