Architecture and method for testing of an integrated circuit device
View Patent ↗In one embodiment, the present invention provides a platform of hardware and/or software that enables the complete access and reliable testing of multiple integrated circuit (IC) devices within a package. This platform may include a testing component (e.g., test circuits, test pads, shared pads, etc.), one or more probe cards and related hardware, wafer probe programs, load board and related hardware of external test equipment, and software and routines for final test programs.
1. A system comprising:
a first integrated circuit device;
a second integrated circuit device implemented on a first monolithic die and connected to the first integrated circuit device, wherein the first and second integrated circuit devices operate in conjunction in a normal operation; and
a testing component implemented on a second monolithic die and operable to be connected between an external test machine and the second integrated circuit device for testing of the second integrated circuit in a test mode, wherein the testing component allows the external test machine to test the second integrated circuit device in the test mode.
2. The system of claim 1 , wherein the first integrated circuit is implemented on a third monolithic die.
3. The system of claim 2 , wherein:
the first integrated circuit exchanges signals with external circuitry over a first group of external connectors during normal operation; and
the testing component exchanges signals with the external test machine over the first group of external connectors during test mode.
4. The system of claim 1 , wherein the first integrated circuit is implemented on the second monolithic die.
5. The system of claim 1 , wherein the first integrated circuit device and the second integrated circuit device are contained in a first package.
6. The system of claim 5 , wherein the testing component is contained in a second package.
7. The system of claim 6 , wherein:
the first integrated circuit exchanges signals with external circuitry over a first group of external connectors during the normal operation; and
the testing component exchanges signals with the external test machine over the first group of external connectors during the test mode.
8. The system of claim 6 , wherein the first package and the second package are contained in a third package.
9. The system of claim 5 , wherein the testing component shares at least one external connector with the first integrated circuit device.
10. The system of claim 1 , wherein the first integrated circuit device, the second integrated circuit device, and the testing component are contained in a single package.
11. The system of claim 10 , wherein the testing component shares at least one external connector with the first integrated circuit device.
12. The system of claim 1 , wherein:
the first integrated circuit exchanges signals with external circuitry over a first group of external connectors during the normal operation; and
the testing component exchanges signals with the external test machine over the first group of external connectors during the test mode.
13. The system of claim 1 , wherein the testing component is incorporated in the external test machine.
14. The system of claim 1 , wherein the testing component is incorporated on a load board in the external test machine.
15. The system of claim 1 , wherein:
the second integrated circuit device operates at a first frequency,
the external test machine provides signals at a second frequency which is lower than the first frequency, and
the testing component processes the signals from the external test machine to generate signals at the first frequency, the testing component providing the signals at the first frequency to the second integrated device during the test mode.
16. The system of claim 1 , wherein:
the second integrated circuit device operates at a first frequency,
the external test machine operates at a second frequency which is lower than the first frequency, and
the testing component converts signals received from the external test machine from the second frequency to the first frequency, and converts signals received from the second integrated Circuit device from the first frequency to the second frequency.
17. The system of claim 1 , wherein the second integrated circuit is not directly accessible by the external test machine.
18. The system of claim 1 , wherein the external test machine can only access the second integrated circuit device through the testing component.
19. The system of claim 1 , wherein signals from the first integrated circuit device are tri-stated during the test mode.
20. The system of claim 1 , wherein the external test machine provides instructions to the testing component for setting test modes and loading test vectors in order to test the second integrated circuit device.
21. The system of claim 1 , wherein the first integrated circuit device comprises memory cells which can substitute for memory cells in the second integrated circuit device.
22. The system of claim 1 , wherein the first integrated circuit device comprises memory cells for storing chip identification information.
23. The system of claim 1 , wherein the testing component allows the monitoring of an exchange of signals between the first integrated circuit device and the second integrated circuit device.
24. The system of claim 1 , wherein the testing component is operable to generate data patterns for testing of the second integrated circuit device.
25. The system of claim 1 , wherein the testing component is operable to generate address patterns for testing of the second integrated circuit device.
26. The system of claim 1 , wherein a first number of signals are communicated between the first and second integrated circuit devices during normal operation and a second number of signals are communicated between the testing component and the external test machine during test mode, and wherein the second number of signals is less than the first number of signals.
27. A system comprising:
a first integrated circuit device implemented on a first monolithic die;
a second integrated circuit device implemented on the first monolithic die and connected to the first integrated circuit device, wherein the second integrated circuit device communicates with the first integrated circuit device to process information during a normal operation; and
a testing component operable to be connected between an external test machine and the second integrated circuit device for testing of the second integrated circuit in a test mode, wherein the testing component is implemented on a second monolithic die, wherein the testing component allows the external test machine to test the second integrated circuit device during a test mode.
28. The system of claim 27 , wherein:
the first integrated circuit exchanges signals with external circuitry over a first group of external connectors during the normal operation; and
the testing component exchanges signals with the external test machine over the first group of external connectors during the test mode.
29. The system of claim 27 , wherein the testing component is incorporated in the external test machine.
30. The system of claim 27 , wherein: p 1 the second integrated circuit device operates at a first frequency,
the external test machine provides signals at a second frequency which is lower than the first frequency, and
the testing component processes the signals from the external test machine to generate signals at the first frequency, the testing component providing the signals at the first frequency to the second integrated device during the test mode.
31. The system of claim 27 , wherein the external test machine can only access the second integrated circuit device through the testing component.
32. The system of claim 27 , wherein the external test machine provides instructions to the testing component for setting test modes and loading test vectors in order to test the second integrated circuit device.
33. The system of claim 27 , wherein the external test machine can only access the second integrated circuit device through the testing component.
34. The system of claim 27 , wherein during the test mode signals from the first integrated circuit device are tri-stated.
35. The system of claim 27 , wherein the external test machine provides instructions to the testing component for setting test modes and loading test vectors in order to test the second integrated circuit device.
36. The system of claim 27 , wherein the testing component allows the monitoring of an exchange of signals between the first integrated circuit device and the second integrated circuit device.
37. A system comprising:
a first integrated circuit device implemented on a first monolithic die;
a second integrated circuit device implemented on a second monolithic die and connected to the first integrated circuit device, wherein the first and second integrated circuit devices operate in conjunction in a normal operation;
a testing component operable to be connected between an external test machine and the second integrated circuit device for testing of the second integrated circuit in a test mode, wherein the testing component allows the external test machine to test the second integrated circuit device in a test mode.
38. The system of claim 37 , wherein the testing component is implemented on the first monolithic die.
39. The system of claim 37 , wherein the testing component is implemented on the second monolithic die.
40. The system of claim 37 , wherein the testing component is implemented on a third monolithic die.
41. The system of claim 40 , wherein:
the first integrated circuit exchanges signals with external circuitry over a first group of external connectors during the normal operation; and
the testing component exchanges signals with the external test machine over the first group of external connectors during the test mode.
42. The system of claim 37 , wherein the first monolithic die and the second monolithic die are contained in a single package.
43. The system of claim 42 , wherein the testing component shares at least one external connector with the first integrated circuit device.
44. The system of claim 37 , wherein the first monolithic die is contained in a first package and the second monolithic die is contained in a second package.
45. The system of claim 44 , wherein the first package and the second package are contained in a third package.
46. The system of claim 37 , wherein:
the second integrated circuit device operates at a first frequency,
the external test machine operates at a second frequency which is lower than the first frequency, and
the testing component converts signals received from the external test machine from the second frequency to the first frequency, and converts signals received from the second integrated circuit device from the first frequency to the second frequency.
47. The system of claim 37 , wherein the testing component is incorporated in the external test machine.
48. The system of claim 37 , wherein the external test machine can only access the second integrated circuit device through the testing component.
49. The system of claim 37 , wherein the external test machine provides instructions to the testing component for setting test modes and loading test vectors in order to test the second integrated circuit device.
50. The system of claim 37 , wherein the first integrated circuit device comprises memory cells which can substitute for memory cells in the second integrated circuit device.
51. The system of claim 37 , wherein the testing component allows the monitoring of an exchange of signals between the first integrated circuit device and the second integrated circuit device.
52. A testing component for testing of a system comprising a first integrated circuit device connected to and operable to operate in conjunction with a second integrated circuit device, wherein the first integrated circuit device is implemented on a first monolithic die and the second integrated circuit device is implemented on a second monolithic die, the testing component comprising:
circuitry for receiving bits of test data from an external test machine at a first frequency;
circuitry for generating a string of bits for each bit of test data from the external test machine; and
circuitry for providing the generated bit strings to the second integrated circuit device at a second frequency, wherein the second frequency is higher than the first frequency.
53. The testing component of claim 52 , wherein the circuitry for generating the strings of bits comprises a data scramble table block.
54. The testing component of claim 52 , comprising:
circuitry for receiving strings of test result data from the second integrated at the second frequency;
circuitry for generating a bit for each string of test result data from the second integrated circuit; and
circuitry for providing the generated bits to the external test machine at the first frequency.